At EQUA, we offer products created by forming multi-layered patterns on various types of glass substrates, silicon wafers, and the like using a variety of metallic films. We are able to offer the optimal processes by utilizing our proprietary pattern data generation technology along with high-precision mask imaging equipment, semiconductor steppers and the like, as well as utilizing such leading edge technologies as photo-etching, lift-off, plating, and sandblasting. We also enable ultra-high-precision machining by using photomask production equipment to perform direct patterning onto the substrate. We can form electronic circuits onto glass, ceramic, and silicon substrates, among others, using a wide of array of metallic thin films consisting of chrome, aluminum, titanium, ITO, and the like.
Photo-etching
With photo-etching, a film is first formed on a substrate by for instance sputtering or deposition of the required metal, and this is coated with photoresist. Then, using a photomask and exposure equipment, the resist is subjected to an exposure development step, and etching is performed to form the desired pattern shape.
Lift-off
With lift-off, photo-etching technology is used to form the pattern which is the opposite of the final shape using, for example, an aluminum film or resist. Then, using for instance sputtering equipment or deposition equipment, a metallic film is formed on the final pattern formation portion. Finally, by removing the initial metallic film or resist, the desired metallic pattern results.
Silicon Wafer Wiring Pattern (in diagram below, patterning onto a step)
Probe Pattern on PI Film
Through-Wiring Pattern on Glass
