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Wafer

At EQUA, we offer products with multilayer patterns formed by various metal films on glass substrates and silicon wafers. We propose the optimal process by leveraging advanced processing technologies, including our unique pattern data generation techniques, high-precision mask imaging equipment, semiconductor steppers, photo-etching, lift-off, plating, and sandblasting. We also enable ultra-high-precision processing by using photomask manufacturing equipment to directly pattern onto the substrate. We can form electronic circuits using various metal thin films, such as chrome, aluminum, titanium, and ITO, on substrates like glass, ceramics, and silicon.

Substrates

  • Glass
Soda lime
Quartz
Alkali-free glass
  • Wafer
Silicon wafer
Compound semiconductor
  • Silicon Carbide (SiC) Wafer
  • Gallium Nitride (GaN) Wafer

  • Printed Circuit Board

List of Glass Wafer

Specifications
Size
4in. / 100mm
5in. / 125mm
6in. / 150mm
8in. / 200mm
12in. / 300mm
Thickness
Available for selection
Flat / Notch
32.5mm
42.5mm
57.5mm
Notch
Notch
Surface Finish
Polished
Film Deposition
Various target deposition
Patterning
Film deposition patterning / Glass etching
Others
Any size (2in+), any shape (e.g., rectangular)

List of Bare Silicon Wafer

Specifications
Size
4in. / 100mm
5in. / 125mm
6in. / 150mm
8in. / 200mm
12in. / 300mm
Thickness
525 um
625 um
625 um
725 um
775 um
Flat/Notch
32.5mm
42.5mm
57.5mm
Notch
Notch
Type/Dopant
P/N
Orientation
(100) / (110) / (111)
Surface Finish
Polished / Etched
Polished / Polished

List of Film Deposition Wafer

Specifications
Size
4in. / 100mm
5in. / 125mm
6in. / 150mm
8in. / 200mm
12in. / 300mm
Thickness
525 um
625 um
625 um
725 um
775 um
Flat / Notch
32.5mm
42.5mm
57.5mm
Notch
Notch
Type / Dopant
P/N
Orientation
(100) / (110) / (111)
Surface Finish
Polished / Etched
Polished / Etched
Deposition
Method
Thermal Oxide Film / Sputtering / LP-CVD / PE-CVD / ALD
Thickness
100 ~ 10000Å
Deposition
SiO2 / SiN / P-TEOS /
 SiON / SiOC / HfO2 / Al / Al-Cu / Au / Pt / Cu / Cr / Ti / Ta / W / Pd / TiN / TaN / AlN / TiC / WC / ITO / SnO2 / ZnO / Ru / Ag-Pd / Co

Patterning

Patterning Details

  • Pattern Process: Photolithography
  • Silicon wafer processing up to 12-inch size
  • From 1x photolithography to steppers
EQUA Co.,Ltd.
Yutaka Bldg. 5F, 8-10-6 Sagami-Ono, Minami-ku, Sagamihara, Kanagawa 252-0303, Japan

Tel: +81-42-745-2027
Fax: +81-42-745-2047

・Photomasks
・Precision Thin Film Products
・Optical Components
・Precision Metal Components

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